High speed chip placement
Blue tape transfer to carrier
Patented Needle-Type Placing Machine with High-Speed and High-Precision Sorting Capability.
Massive transfer laser bonding
Carrier transfer to substrate (Massive soldering)
Exclusive patented laser welding machine, offering the largest single-weld transfer area available on the market.
Laser assisted die bonding
Blue tape transfer to substrate (Die bonding)
World's first exclusive patented design:
transferring LED from the blue tape to the substrate while simultaneously performing laser welding.
Offers exceptionally high rework efficiency and yield, and capable of after molding rework for products.
Chip sorter
Chip sorting to blue tape
Patented Needle-Type Sorting Machine with High-Speed, High-Precision Sorting and Placing Functionality.
High speed chip placement
Massive transfer laser bonding
Massive transfer laser bonding
Blue tape transfer to carrier
Capacity: + 200K/hr @ P0.5mm
Accuracy: ± 10um
Minimum chip size: 0204 mil
Double ring size: 6 inch
Massive transfer laser bonding
Massive transfer laser bonding
Massive transfer laser bonding
Carrier transfer to substrate (Massive soldering)
Capacity: + 200K/hr @ P0.5mm
Accuracy: ± 10um
Minimum chip scale: 0204 mil chip size
450um pixel pitch
Mass transfer area: 100 x 100mm
200 x 200mm(2023/Q3)
Laser assisted die bonding
Massive transfer laser bonding
Laser assisted die bonding
Blue tape transfer to substrate (Die bonding)
Capacity: 6s/die (repair mode)
4s/die (debond mode)
Accuracy: ± 10um (mLED), ± 5µm (µLED)
Minimum chip size: < 15 x 30µm
Support multi-functions switch:
(a)Debond (b)Repair (c)Solder dispensing/dipping (optional)
Chip sorter
Massive transfer laser bonding
Laser assisted die bonding
Chip sorting to blue tape
Capacity: 60K/hr @ P1mm
Accuracy: ± 25µm
Minimum chip size: 0305 mil
Different bin temporary storages: 150